High-speed thick copper plating method for high thermal conductivity high-frequency substrate development.
Challenges related to mass production that were previously unattainable, substrate reliability, and thin plate compatibility have also been cleared.
"Kyoden's Latest Technology: High-Speed Thick Copper Plating Method" This new technology has enabled the development of high heat dissipation, high-frequency substrates. 【Features】 ♢ Overcomes challenges in mass production, substrate reliability, and thin plate compatibility that were previously unattainable ♢ Technology that can also be used for build-up substrates ♢ Compatible with 5G/6G and power semiconductor components ◎ *For more details, please refer to the related links or feel free to contact us.
- Company：キョウデン
- Price：Other
